Semi Automatic Dip Coating for Application of Conformal Coatings to Printed Circuit Board Assemblies
Semi Automatic Dip Coating is one of the most efficient methods for application of conformal coatings and is excellent for all volume production whether large or small
The process of dipping a circuit board into a conformal coating material contained in a tank at a controlled speed of immersion and withdrawal ensures complete coverage, including underneath components and around difficult large 3D boards and there is no over spray or material wastage.
The control of the speed in and out combined with the viscosity of the material defines the coating thickness of the Printed Circuit Board and the tolerance can be controlled extremely accurately.
Contact SCH Technologies directly to discuss dip coating of printed circuit boards or click conformal coating dip application for further details.