What is an epoxy potting compound?
An epoxy potting compound (encapsulate) is a material used to encase a printed circuit board and protect it from environmental exposure to impact, shock, vibration, heat, conductivity, moisture, chemicals. Some products are pigmented and are used to hide the circuitry from inspection and so add security to a device. The material is based upon an epoxy resin which can be made of one, two or three part components (two and three-part products need to be mixed together) which when cured produce a protective shell.
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