Tag Archive | potting compounds

What is an epoxy potting compound?

An epoxy potting compound (encapsulate) is a material used to encase a printed circuit board and protect it from environmental exposure to  impact, shock, vibration, heat, conductivity, moisture, chemicals.  Some products are pigmented and are used to hide the circuitry from inspection and so add security to a device. The material is based upon an epoxy resin which can be made of one, two or three part components (two and three part products need to be mixed together) which when cured produce a protective shell.

If you would like to know more click different epoxy potting compounds. For further information on our other products and services offered and supported by SCH Technologies, please do not hesitate to contact us

Telephone: +44 1226 249019

Email: sales@schservices.com

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How do I cure my Epoxy Potting Compound?

Heat accelerated cures for epoxy potting compounds and encapsulating processes not only shorten cures from days to minutes or hours, but typically give better proper ties.

To room temperature cure the MG epoxies let stand for 24 hours.

To heat cure the MG epoxies

  • Put in oven at 65 °C [149 °F] for 60 minutes. –OR–
  • Put in oven at 80 °C [176 °F] for 45 minutes. –OR–
  • Put in oven at 100 °C [212 °F] for 35 minutes.

After the initial curing, the epoxy proper ties should continue to improve with time until it reaches its optimum proper ties.

Click Epoxy FAQs for further questions on epoxy compounds.

How do I create the right mixture for my pottng compound?

Generally, the most critical part of the potting process is the mixing. To create a potting mixture

 

  1.   Measure a volume of pre-stirred A, and pour in the mixing container.
  2. By the given ratio, measure the corresponding volume of pre-stirred B, and slowly pour in the mixing container while stirring.
  3. With a Mix paddle, scrape the walls and bottom of the mixing container.
  4. For 3 minutes, stir slowly in a circular unidirectional motion while folding the material from the bottom onto the top to create a homogeneous mixture.
  5.   Let sit for 30 minutes to de-air. —OR— Put in a vacuum chamber, bring to 25 Hg/in pressure, and wait for 2 minutes to de-air.
  6. If bubbles are present at top, use the mixing paddle to break them.

The potting mixture is ready to use. At room temperature, the pot life of the mixture is one hour after first initial mixing. Higher temperatures lower viscosity of the mixture and allows for faster de-airing;  however, greater than room temperature shortens the pot life. Similarly, lowering the mixture temperature increases pot life but increases viscosity.

Click Epoxy FAQs for further questions on epoxy compounds.

Can I protect my electronics intellectual property (IP) with an epoxy potting compound?

The answer is simply yes.

A major use of black epoxies is to protect intellectual property. The fact that epoxies are extremely hard and chemical resistant means that they are very difficult to remove non-destructively. This makes them one of the preferred choices to protect proprietary electrical circuits designs.

For example, one of our customers has a very specific power supply. This power supply takes less space than their competitors which gives them a competitive advantage. Because they are keen on keeping their design as a trade secret, they pot their components in the 833FRB epoxy. Potting their components in the 833FR epoxy allows their power supply to meet UL 94 and still protect their IP.

If you would like to know more about epoxy potting compounds or other products and services offered and supported by SCH Technologies, please do not hesitate to contact us

Telephone: +44 1226 249019

Email: sales@schservices.com

Click Epoxy Potting Compounds  for the full range of information

Click Contact Us to send us your requests.